High Speed PCB Design - Enhance Experiment Method (EEM)
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Signal Integrity (SI) and Power Integrity (PI) is one of the key factors in achieving optimum board/system performance and is a main concern in today's high-speed designs. At speeds where the electrical delay exceeds or becomes a significant portion of the signal edge-times, interconnects must be considered as transmission lines with distributed properties, similar to microwave circuits. Transmission lines must be designed to minimize distortion of the signals at the receivers. |
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Therefore, we are implementing Experiment Enhance Method (EEM) in the new generation high-speed printed circuit board designing methods is based on critical design rules or guidelines which have identified through the Pre-Design Simulation stage for robust and reliable design.
As we knew, tolerance is an important factor during semiconductor and printed circuit board fabrications. This has lead to a phenomenon that the system or board facing booting up problem but the same design had identified to be functional during the prototype stage. This had given us a clue that fabrication tolerance is an essential factor to be considered in the design.
Through the combination of commercial simulation system and the know-how, the EEM method is able to consider the fabrication tolerance factor effectively in a short period during the design process.
The effectiveness of the EEM had helped to reduce the iteration of design modification final stage of design and contribute to the robustness of design known as Robust Design.
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